SAE J469 Zinc Die Casting Alloys

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Product Code:SAE J469
Title:Zinc Die Casting Alloys
Issuing Committee:Metals Technical Executive Steering Committee
Scope:Because of the drastic chilling involved in die casting and the fact that the solid solubilities of both aluminum and copper in zinc change with temperature, these alloys are subject to some aging changes, one of which is a dimensional change. Both of the alloys undergo a slight shrinkage after casting, which at room temperature is about two-thirds complete in five weeks. It is possible to accelerate this shrinkage by a stabilizing anneal, after which no further changes occur. The recommended stabilizing anneal is 3 to 6 h at 100 掳C (212 掳F), or 5 to 10 h at 85 掳C (185 掳F), or 10 to 20 h at 70 掳C (158 掳F). The time in each case is measured from the time at which the castings reach the annealing temperature. The parts may be air cooled after annealing. Such a treatment will cause a shrinkage (0.0004 in per in) of about two-thirds of the total, and the remaining shrinkage will occur at room temperature during the subsequent few weeks. Stabilizing results in a decrease in dimensions of about 0.0005 in per in from the original size of the casting. Stabilizing is, of course, unnecessary if the machine or fitting operations can be delayed until the castings have aged five weeks at room temperature.ns of about 0.0005 in per in from the original size of the casting. Stabilizing is, of course, unnecessary if the machine or fitting operations can be delayed until the castings have aged five weeks at room temperature.
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基本信息
标准名称:火柴刷磷、包封、套箱机
中标分类: 轻工、文化与生活用品 >> 轻工机械 >> 其他轻工机械
发布部门:中华人民共和国轻工业部
发布日期:1992-02-21
实施日期:1992-08-01
首发日期:1900-01-01
作废日期:1900-01-01
提出单位:轻工业部技术装备司
归口单位:全国轻工业机械标准化中心
起草单位:武汉轻工业机械厂
起草人:王传清、刘民鑫
出版社:中国轻工业出版社
出版日期:1992-08-01
页数:7页
适用范围

本标准规定了火柴刷磷、包封、套箱机的产口分类、技术要求、试验方法、检验规则、标志、包装、运输、贮存。
本标准适用于火柴刷磷、包封、套箱多功能机(以下简称刷包机),亦适用于单功能机器。

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所属分类: 轻工 文化与生活用品 轻工机械 其他轻工机械
Product Code:SAE ARP1332
Title:Wave Soldering Procedure
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards.In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.